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SALIZA AZLINA BINTI OSMAN
salizaz@uthm.edu.my
View Curriculum Vitae

Note : H-index and Citation are based on current records accessed through the Scopus API.


  • Areas of Research Interest

    • Info!

    Areas of Research Interest Not Found.

  • List of Grant Awarded
    • 01-NOV-24 ~ 30-APR-27 Q815 : Interfacial Reaction and Corrosion Behavior of Different Solder Composition on Electroless Nickel/ Electroless Palladium/ Immersion Silver Surface Finishes Through Laser Soldering
    Lead-free solder; Laser soldering; Surface Finish; Intermetallic compound, Universiti, RM 51000

    01-SEP-24 ~ 31-AUG-26 Q780 : Evaluation of Printed Circuit Board Performance in Laundry Machine Under Specific Operating Environment
    PCB, Surface Finish, Laundry Machine, Ageing, Universiti, RM 40000

    01-JUN-25 ~ 31-MAY-26 J046 : Microwave-Assisted Enhancement of Lead-Free Solder Joints and Alternative Surface Finishes on Printed Circuit Boards
    Microwave Energy; Intermetallic Compound; Lead-free Solder; Surface Finish, Universiti, RM 20400

    01-MAR-23 ~ 28-FEB-25 Q273 : Investigation of Engineering Materials and Corrosion Behaviour during Manufacturing Processes
    Corrosion; Manufacturing process; Work study, Universiti, RM 36000

    01-OCT-22 ~ 30-SEP-24 M115 : Investigation of Engineering Materials and Corrosion Behaviour during Manufacturing Processes
    Materials Engineering, Corrosion, Manufacturing Processes , Kebangsaan, RM 79432

    13-FEB-23 ~ 31-DEC-23 X250 : INTERNATIONAL AND INDUSTRY RECOGNIZED ASNT ULTRASONIC TESTING THICKNESS MEASUREMENT (UTTM) TECHNICIAN COURSE
    TESTING THICKNESS , UTTM, Kebangsaan, RM 150000

    01-SEP-19 ~ 31-AUG-22 K196 : Solder joint evolution on ENEPIS surface finish via laser reflow soldering for electronic devices assembly
    Lead-free Solder; Laser Reflow Soldering; Surface Finish, Intermetallic Compound; , Kebangsaan, RM 116750

    01-NOV-20 ~ 31-OCT-21 B093 : T-KIT: Solution For Tayammum
    tayammum, ergonomic, teaching aids, intergrated design, Universiti, RM 20000

    01-NOV-18 ~ 30-APR-21 H363 : Intermetallic Compound Evolution between Low Temperature Lead-Free Solders and Alternative Surface Finishes
    Soldering; Lead-Free Solders; Intermetallic compound; Isothermal Aging; Surface finish, Universiti, RM 30000

    01-JUL-18 ~ 30-JUN-20 H225 : The Effect of Silver percentage in Lead-Free Solders on Intermetallics Growth
    Soldering; Lead-Free Solders; Intermetallic compound; Multiple reflow; Isothermal Aging, Universiti, RM 20000

    01-NOV-18 ~ 30-JUN-20 H323 : Experimental and Simulation Study on Lead-free Solders and ENIMAG surface finish
    Lead Free Solder; Isothermal Aging; ENIMAG; Intermetallic Compound; Simulation, Universiti, RM 20000

    01-AUG-16 ~ 31-JUL-18 1595 : Determining Flow Behavior and Characterization of Quality Through Processing Condition of Injected Mold Polypropylene-Nanoclay-Gigantochloa Scortechini fibers.
    injection molding, polypropylene, nanoclay, Kebangsaan, RM 67700

    01-MAR-16 ~ 28-FEB-17 U487 : Interfacial Reaction Between Lead-Free Solders and Electroless Nickel-Immersion Silver (ENilmAg) Surface Finish
    rabiatul3190, Universiti, RM 15600

    01-DEC-14 ~ 30-NOV-16 1493 : Solder joint reliability on electroless nickel-immersion silver(ENiImAg)surface finish for printed circuit board application
    electronic materials, Kebangsaan, RM 112200

    01-SEP-13 ~ 31-AUG-15 R030 : Investigation of Polymer Nano-Compositers(PNC) Material for Biomedical Application Via Fused Deposititon Modelling (FDM) Routes
    RAGS, Kebangsaan, RM 80000

    15-MAR-11 ~ 14-MAR-12 0794 : Intermetallic compound between lead-free solders and silver surface finish
    , Antarabangsa, RM 10000

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